Upcoming Events

Guest Presentation and Reception

Hosted by OIDA in partnership with the OSA Rochester section
16 October, 2012 – Rochester, NY, USA

Recent Events

Photonic Integration Workshop - Photonics integration is emerging from the “gee whiz” stage to a critical technology for the next generation of telecom transport systems, according to OIDA’s June workshop on that topic. High data rates of 100 Gbps and greater will require the close photonic integration of optics and electronics to reduce parasitic losses, and the technology also has the potential to reduce packaging costs. Participants at the workshop differed over the best route toward photonics integration, however, presenters reported progress toward their goals.



Infinera represented perhaps the most commercialized photonics integration technology, with monolithic integration of multiple elements onto InP material. Infinera uses 100 Gbps transmitter and 100 Gbps receiver chips in its systems today, and is already fabricating 500 Gbps chips for next generation systems, with plans for 1 Tbps and beyond. At lunch, David Welch spoke about Infinera’s expectation of the convergence of optical network layers, eliminating such boxes as stand-alone WDM and stand-alone optical cross-connects.



Aurrion also suggested using monolithic integration, fabricating III-V elements with CMOS electronics on a single wafer-bonded platform.



Several presenters argued for hybrid integration of III-V active elements onto pre-fabricated CMOS and silica waveguides. Some solutions include flip-chip bonding III-V lasers and detectors onto silicon, although Luxtera keeps the laser apart in some cases to avoid heating the electronics. JDS Uniphase, Oclaro, and others took it further, highlighting the need for diverse platforms that include not only silicon and InP, but also GaAs and lithium niobate. A common theme among these companies was that no single material technology will dominate, the world being too complex to allow monolithic integration on a common material, such as one as expensive as InP.



Verizon argued for pure “silicon photonics” as the optimal approach; that is, monolithic integration of silicon active photonics with passive elements and CMOS electronics. It was the most speculative suggestion of the day, with the presenter saying that commercial silicon lasers may be just 1-2 years away. Notably, however, Verizon does not manufacture or commercialize components itself.



The divergent views of photonic integration are not necessarily far apart, if one considers that even the most monolithically integrated approach requires off-chip electronics. The differences are partly a matter of definition.



The workshop was held June 21 in Colorado Springs, collocated with the OSA Advanced Photonics Congress. The workshop is becoming an annual event, focusing on commercial progress in the technology, with each year focusing on a different theme. 

Special thanks to OIDA member company Infinera for their generous support of this event.

Publications

Report on Opportunities and Trends in Optoelectronic Manufacturing is Now Available! 
OIDA is pleased to announce the availability of a new summary report on the workshop entitled “Opportunities & Trends in Optoelectronic Manufacturing,” held in Los Angeles in March 2012. The 45-page report provides a global perspective on current trends in optoelectronic manufacturing and comprehensively captures government initiatives in advanced manufacturing in North America and in Europe. This report is timely considering that the US Government has recently posted a request for information (RFI) and is actively seeking input for its new National Network for Manufacturing Innovation (NNMI) initiative. Through NNMI, the government is seeking to establish up to 15 innovative manufacturing institutes to advance the state of manufacturing technology in a variety of fields. 



OIDA is actively planning to lead a response to this RFI on behalf of its member companies with the goal of seeking to establish one such institute devoted to advanced optoelectronic manufacturing. The RFI seeks input in the following broad areas:

• Technologies with Broad Impact
• Institute Structure and Governance
• Strategies for Sustainable Institute Operations
• Education and Workforce Development

Click here to view this RFI as published in the Federal Register.

(For help with your membership credentials, please email OIDA team member Brooke Hirsch at bhirsc@osa.org)

Videos

Photonic Integration Videos are Now Available! 
View video recordings and the individual slide presentations from the OIDA-hosted Photonic Integration Workshop which took place at the Advanced Photonics Congress in Colorado Springs, CO. 

(For help with your membership credentials, please email OIDA team member Brooke Hirsch at bhirsc@osa.org)

Member Directory

Please join us in welcoming Acacia Communications, Inc., Menara Networks and the University of Delaware, Dept. of Electrical and Computer Engineering to the OIDA membership.

Please visit the Member Directory for a full listing of OIDA members.